Greener BeeGreen ElectronicsRenesas Electronics Expands 3D Graphics Cluster Market to Entry …

SANTA CLARA, Calif.–(BUSINESS WIRE)–Renesas Electronics Corporation (TSE:6723), a premier supplier of
advanced semiconductor solutions, today announced its high-performance
R-Car D3 automotive infotainment system system-on-chip (SoC), designed
to expand the use of 3D graphics instrument clusters (3D clusters) that
support 3D graphics displays in entry-class cars. The R-Car D3 achieves
both high-performance graphic capabilities and contributes to
significant reduction in overall system development cost.

The new SoC includes a high-performance 3D graphics core that enables a
high-quality 3D display and lower system costs equivalent to the bill of
materials (BOM) costs of developing with 2D graphics instrument clusters
(2D clusters).

By adopting the R-Car D3, system developers can re-use their 3D graphics
development assets, including software and graphics designs from
high-end vehicles that adopt high-performance R-Car H3 or R-Car M3 SoCs
to entry-level cars. This scalability enables development of easy-to-use
and high visibility entry cluster 3D graphics at approximately the same
level cost as the existing 2D clusters. In addition, Renesas
collaborates with industry-leading partners in the instrument cluster
field to further reduce development steps and costs.

“Full graphics cluster systems equipped with a large thin filter
transistor panel are expected to become mainstream for future vehicles,
which will require high-definition 3D graphics displaying at a high
speed to accurately convey information to the driver,” said Toshiaki
Ishibashi, Managing Officer, Engineering Headquarters, Nippon Seiki Co.,
Ltd. “We are excited that the R-Car D3 will respond to this need as well
as reduce BOM costs.”

“For more than a decade, automotive OEMs and Tier 1s have relied on
BlackBerry QNX® to deliver world-class software solutions for
infotainment, telematics, and instrument cluster systems,” said Grant
Tourville, senior director of product management at BlackBerry QNX. “The
combination of the new R-Car D3 SoC and BlackBerry’s ISO 26262 ASIL
B-certified QNX Platform for Instrument Clusters will enable our
customers to confidently deliver state-of-the-art, safety-certified
digital clusters rapidly to the market.”

“The safe and secure INTEGRITY® real-time operating system is widely
used for automotive in-vehicle infotainment and instrument clusters in
productions programs around the globe. Our support for the R-Car D3
builds on years of successful partnership with Renesas and their other
R-Car devices, providing the customer with certified automotive safety,
time-savings development tools, and optional virtualization for Linux,”
said Matt Sager, Director of Asia-Pacific Business Development at Green
Hills Software. “We see this third-generation R-Car D3 as a valuable
addition to the R-Car Family of SoCs, enabling customers to easily
migrate and reuse existing R-Car and INTEGRITY software assets for
faster time to market for their next-generation integrated cockpit
designs.”

“For practical implementation of autonomous driving, the instrument
cluster needs to instantly, accurately, and safely report a wide variety
of information to the driver. The Renesas R-Car D3, which provides
powerful graphics capabilities and critical functional safety features
for instrument clusters, is expected to revolutionize the 3D cluster
user experience,” said Lynwood Stanley, Vice President of Global
Engineering Services at Altai. “Altai is using our Deep Screen code
generator, which optimizes the HMI code, for the Renesas R-Car with the
goal to deliver the highest-performance embedded HMIs to the market.”

“For instrument clusters based on large-scale LCD displays, the market
is expected to grow rapidly in the future, and it would be a great
benefit to the customer to be able to implement such instrument clusters
at a low BOM cost,” said Rock Yang, Vice President at Thunder soft. “As
one of the leading providers of UI/UE and OS technology, we at Thunder
soft provide both software system integration and our HMI tool ‘Kanzi’
for the R-Car including the new R-Car D3. We believe we can work with
Renesas to drive the R-Car solutions market.”

The increasing number of connections between the instrument cluster and
the various sensors and control devices allows more information about
the vehicle and its surroundings to be captured and displayed on the
instrument cluster. However, this increases the need for improved
visibility from a safety point of view.

Currently, entry-class vehicles feature mostly 7- to 10-inch liquid
crystal displays (LCDs) that support mainly 2D graphics. In the future,
advancements in automotive LCDs size, resolution, and prices will
support an anticipated explosive demand in 3D clusters to meet the
growing need for clearer and highly visible designs on a large screen,
particularly in the Chinese market.

In the meantime, system developers working with automotive instrument
clusters must manage an increasing number of development steps and
costs, as 3D clusters for entry-class cars are required to meet both the
strict cost and high-performance as existing 2D clusters but with 3D
graphics drawing requirements.

Renesas developed the R-Car D3 with these functions and performance
capabilities in mind, offering developers a reliable, robust 3D clusters
solution that is scalable from entry-level to high-end vehicles.

Key features of the R-Car D3

  • High-performance 3D graphics core that
    enables high-quality 3D display and lower system costs equivalent to
    that of 2D cluster development

    The new SoC includes a
    3D graphics core that enables high-performance human-machine interface
    (HMI) and realizes significantly reduced system development cost
    equivalent to those of existing 2D cluster systems.

3D graphics core that enables high-performance HMI
Leveraging
one of the latest graphics cores from Imagination Technologies, Inc, the
Power VR® Series 8XE, the R-Car D3 achieves approximately six times
improved drawing performance compared to the existing 3D graphics R-Car
D1 SoC.

This allows system developers to reuse content
created for high-end cars in entry-class cars, and system designers who
had previously been concerned about hardware graphics performance
limitations can now create graphics content without concern or
limitations.

Reduced system costs by approximately 40 percent compared to existing
Renesas devices (Note 1)

The R-Car D3 adopts the ball grid
array (BGA) package, which simplifies the use of printed circuit boards
(PCBs). This allows system developers to create 3D clusters using
low-cost, four-layer PCBs, reducing the system BOM costs. The Renesas
R-Car D3 reference boards, also use four-layer PCBs, and Renesas
provides the design data as reference data for system developers to
simplify the design of their own systems. In addition, since the new SoC
achieves industry-leading level of low power consumption (Note 1),
developers can configure a power supply circuit using a relatively
inexpensive discrete power supply regulator. Since a cluster system can
be configured with one DDR SDRAM, it is possible to reduce BOM cost by
approximately 40 percent (Note 1) compared with 3D cluster systems that
include the existing R-Car D1, realizing the total system development
cost equivalent to the existing 2D cluster. The automatic memory
calibration function (Note 2) of the DDR SDRAM, which is standard in
R-Car SoCs, eliminates the need for timing adjustment of data transfer
with the SRAM and memory evaluation man-hours requirements.

  • Robust partner ecosystem to streamline
    development steps

    Renesas works with several operating
    system (OS) manufacturers, HMI manufacturers, and system integrators
    who are leading the instrument cluster field. System developers can
    take advantage of a wide range of automotive solutions by working with
    the more than 200 Renesas R-Car Consortium partner companies to
    further reduce the number of development steps and cost for 3D
    graphics.

In addition, the R-Car D3 uses open GL ES 3.1 for 3D graphics drawing,
which enables scalability with third-generation R-Car devices.
Furthermore, the new SoC uses the same 2D graphics core as the RH850/D1M
microcontroller (MCU) for 2D graphics applications. This assures that
users will be able to reuse all their software assets and design content
assets development from applications ranging from 2D clusters to
high-end 3D clusters.

As part of the third-generation R-Car SoC Family, the R-Car D3 supports
the ISO 26262 (ASIL-B) automotive functional safety standard, and
provides a functional safety support program for implementing safe
driving support systems, contributing to the realization of a safe
driving experience.

Availability

Samples of the R-Car D3 are available now. Mass production is scheduled
to begin in September 2019 and is expected to reach a volume of 200,000
units per month in September 2020. (Availability is subject to change
without notice.)

(Note 1) According to Renesas research.

(Note 2) A function that automatically adjusts the timing to solve the
individual differences of SoC, DDR SDRAM, and printed circuit board,
which is essential for using DDR SDRAM.

For more information about Renesas, follow Renesas Electronics America
at @RenesasAmerica on Twitter and https://www.facebook.com/RenesasAmericas/.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE:6723) delivers trusted embedded
design innovation with complete semiconductor solutions that enable
billions of connected, intelligent devices to enhance the way people
work and live—securely and safely. A global leader in microcontrollers,
analog, power, and SoC products and integrated platforms, Renesas
provides the expertise, quality, and comprehensive solutions for a broad
range of Automotive, Industrial, Home Electronics, Office Automation and
Information Communication Technology applications to help shape a
limitless future. Learn more at renesas.com.

(Remarks) PowerVR is a registered trademark of Imagination Technologies
Limited. QNX, neutrino and Blackberry are trademarks from BlackBerry
Limited, and are used with permission from QNX Software System Limited.
Green Hills Software and INTEGRITY are trademarks or registered
trademarks of Green Hills Software, Inc. in the U.S. and/or
internationally. All names of products or services mentioned in this
press release are trademarks or registered trademarks of their
respective owners.

Article source: http://www.businesswire.com/news/home/20171031005590/en/Renesas-Electronics-Expands-3D-Graphics-Cluster-Market


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